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Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
April 4, 2024 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
Chrys Shea of Shea Engineering and Altium’s David Haboud educate us on the latest revision of the SMT test board for UHDI testing, presented at the SMTA UHDI Symposium on March 26 in Arizona. Chrys was involved in the original SMT test board, introduced roughly five years ago. She and David discuss recreating the test board to be appropriate for UHDI, the genesis and history of this project, and why industry members should make use of it to benchmark their processes.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
LPKF Extends Contract of CEO Klaus Fiedler until 2028
04/24/2024 | LPKFThe Supervisory Board of LPKF Laser & Electronics SE has decided to extend the contract of Dr. Klaus Fiedler as CEO until 31 December 2028. "Under the leadership of Klaus Fiedler, LPKF has undergone some extensive transformation since he joined just over 2 years ago.
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.